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Leapfive Technology Will Be Showcasing High-End Industrial Chip Products

at the 2023 Energy Electronics Expo

 

 

 

From November 8 to 10, 2023, Guangdong LeapFive Technology Co., Ltd. (hereafter referred to as “LeapFive Technology”) extends a warm invitation to visit Booth A510 in Building 5 of the China Zhuhai International Convention and Exhibition Center for the 2023 Energy Electronics Expo.

This expo encompasses an expansive exhibition area of over 20,000 square meters, focusing on four key sectors: photovoltaics, new energy storage, key terminal applications, and critical information technology. Nearly a hundred distinguished and innovative companies are participating, offering a wide array of products and providing a comprehensive solution for cutting-edge technology and products in the “light-storage-end information” domain.

 

 

 

 

LeapFive Technology is committed to developing SoC chips and system solutions based on the open-source RISC-V architecture while delivering full-stack foundational intelligent software services that span various domains, from operating systems to cloud platforms. We actively integrate cross-technologies, such as artificial intelligence, the Internet of Things, and blockchain, to support the innovation and application of China’s digital economy. As early pioneers in RISC-V architecture SoC chip design and industrial applications, we have successfully launched two chip products that cover the realms of perception and edge computing in the AIoT field.

During the event, LeapFive Technology will showcase the application scenarios of the NB2 edge intelligent core component and the BF2 wireless power metering module in intelligent energy. For instance, the transmission line edge smart platform, built with the industrial-standard SoC chip NB2 based on the open-source RISC-V instruction set, achieves autonomous and controllable solutions from chip to hardware to software, effectively mitigating supply chain risks. The development of a transmission line monitoring platform based on RISC-V SoC and the expansion of a secure and controllable edge computing framework will support various energy monitoring terminals, sensors, and multiple device nodes, enabling efficient edge artificial intelligence algorithms.

 

Key Product Introduction:

LF-NB2
The industry’s first RISC-V-based
High-end Edge Intelligent Application Processor

The NB2 core board is a high-performance core board developed by LeapFive Technology based on NB2 (LF566) and designed for industrial IoT applications. It features a RISC-V primary control chip, multiple high-speed storage devices, high integration, and rich expansion interfaces tailored to industrial-grade requirements. It encompasses essential features, including the NB2 (LF566) main controller chip, various memory options, a Linux operating system, and features like high-speed and low-speed interfaces. It also includes critical features such as a debug serial port, JTAG interface, and 5V/1A and 3.3V/1A power inputs. Regarding physical specifications, it has dimensions of 70mm x 55mm and four 80-pin board-to-board connectors, making it an ideal choice for industrial IoT applications. This core board is a reliable foundation, offering robust performance for projects in various industrial IoT scenarios.

 

 

 

LF-BF2
Industry’s first RISC-V-based.
Wi-Fi/BLE combined function chip

The wireless metering acquisition module, designed and developed based on the BF2 chip, is employed for measuring and metering power parameters during power supply. It supports various wireless communication methods, including RS485, Wi-Fi, and BLE, making it convenient for users to monitor, collect, and manage electricity consumption. The product boasts high precision and a compact form factor. It enables itemized power measurement, statistics, and analysis for different regions and loads.

 

 

The sales and technical staff at LeapFive Technology will introduce the application scenarios of these products and customized solutions across different fields and industries. We welcome you to visit our booth for discussions and insights.